A technical paper titled “Comparative Evaluation of Thermal Properties in Molybdenum Substrate to Silicon and Glass for a System-on-Foil Integration” was printed by researchers at Rochester Institute of Know-how and Lux Semiconductors.
Summary:
“Superior electronics know-how is transferring in direction of smaller footprints and better computational energy. To be able to obtain this, superior packaging strategies are at the moment being thought of, together with natural, glass, and semiconductor-based substrates that enable for two.5D or 3D integration of chips and units. Steel-core substrates are a brand new various with comparable properties to these of semiconductor-based substrates however with the added advantages of upper flexibility and steel ductility. This work comprehensively compares the thermal properties of a novel metal-based substrate, molybdenum, and silicon and fused silica glass substrates within the context of system-on-foil (SoF) integration. A easy digital method is used to simulate the warmth generated by a typical CPU and to measure the warmth dissipation properties of the substrates. The outcomes point out that molybdenum and silicon are capable of successfully dissipate a steady energy density of two.3 W/mm2 because the floor temperature solely will increase by ~15°C. In distinction, the floor temperature of fused silica glass substrates will increase by >140°C for a similar utilized energy. These easy strategies and measurements had been validated with infrared digital camera measurements in addition to by means of finite factor evaluation through COMSOL simulation. The outcomes validate the usage of molybdenum as a complicated packaging substrate and can be utilized to characterize new substrates and approaches for superior packaging.”
Discover the technical paper right here. Revealed Could 2024.
Huang, Tzu-Jung, Tobias Kiebala, Paul Suflita, Chad Moore, Graeme Housser, Shane McMahon, and Ivan Puchades. 2024. “Comparative Evaluation of Thermal Properties in Molybdenum Substrate to Silicon and Glass for a System-on-Foil Integration” Electronics 13, no. 10: 1818. https://doi.org/10.3390/electronics13101818
Associated Studying
The Race To Glass Substrates
Changing silicon and natural substrates requires big shifts in manufacturing, creating challenges that can take years to iron out.
